Product Description

Detailed Product Description Applications - High bit rate data transmission - Telecommunications - Testing instruments - Active device terminations - LAN/WAN - FTTX. Features - SM & MM available - Standard & custom configurations - Meets Telecordia-GR****-CORE specifications - Low insertion loss - Ultra low back reflection - For 3.0mm, 2.4mm, 2.0mm jacket or **0μm buffer. - Insertion loss: SM: ≤0.2dB MM: ≤0.5dB - Return loss: PC polish: ≤*5dB UPC polish: ≤*0dB APC polish: ≤*5dB - Each test insertion loss changes: - Interchangeable test: ≤0.2 dB - The vibration test: ≤0.1 dB (****0Hz, 1.5 mm amplitude) - Tensile tests: ≤ 0.1 dB (***5Hg tension, φ 0.9 mm fiber except) - High temperature testing: ≤0.2 dB (+ *5 ° c for **0 hours), - Low temperature test: ≤0.****0 degrees Celsius (dB for **0 hours), - The temperature cycling tests: ≤ 0.2 dB (- *0 ~ *5 ° c + 5 times), - Humidity test:≤ 0.2 dB (**5 ° ~ + *5 ° c, relative humidity *3%, **0 hours)